ACP Industry Forum on Optical Interconnects
15 November 2011
A full day ACP Industry Forum on Optical Interconnects will take place on Nov 15 comprising tutorials, invited talks, as well as panel discussions.
Optical communication is penetrating to ever shorter distances and is expected to repeat the tremendous success of telecom in the field of optical interconnects at different levels in computing systems and consumer electronics. Optical interconnects in data centers, servers, blades have become increasingly the choice of technology over the conventional copper solutions.Wide spread applications of optical interconnects for consumer electronics has long been predicted as the next new frontier, despite the fact that there are only limited commercial deployment for such applications so far. In comparison with the optical communications in telecom, the short-reach optical interconnets pose different requirements on photonics with respect to the crucial issues of power consumption and cost, which are decisive for the continued dynamic growth of the information society. This forum will bring together industry and academy experts to discuss the current status, needs and future development in the emerging dynamic field of optical interconnects for different applications. The IF will cover, but is not limited to:
• Optical interconnect in high performance data centers and computing systems
• New enabling architectures
• Keeping power consumption and cost at sustainable levels with increasing requirements on system capacity
• Accessible and desirable functionality of photonics technology for optical interconnect
• Technology for interconnects at center, cabinet, board and chip level
All speakers are invited only to ensure the scope, focus and quality of the presentations to maximize the values of the forum to the attendees. Also,
we will have a panel discussion at the end of the sessions to facilitate brain-storming discussions on some of the critical and pressing issues related to the technologies and applications. This industry forum will be sponsored by HP. Leading industry experts and representatives from academia will present and attend this exciting event. Focus will be on industry related issues.
Industry Forum Organizers
Lars Thylén, Royal Institute of Technology (Sweden) and Hewlett-Packard Labs. (United States)
Michael Tan, Hewlett-Packard Labs. (United States)
Wei Ping Huang, McMaster Univ. (Canada)
Frank Tong, SAE Magnetics (Hong Kong)
Optical communication is penetrating to ever shorter distances and is expected to repeat the tremendous success of telecom in the field of optical interconnects at different levels in computing systems and consumer electronics. Optical interconnects in data centers, servers, blades have become increasingly the choice of technology over the conventional copper solutions.Wide spread applications of optical interconnects for consumer electronics has long been predicted as the next new frontier, despite the fact that there are only limited commercial deployment for such applications so far. In comparison with the optical communications in telecom, the short-reach optical interconnets pose different requirements on photonics with respect to the crucial issues of power consumption and cost, which are decisive for the continued dynamic growth of the information society. This forum will bring together industry and academy experts to discuss the current status, needs and future development in the emerging dynamic field of optical interconnects for different applications. The IF will cover, but is not limited to:
• Optical interconnect in high performance data centers and computing systems
• New enabling architectures
• Keeping power consumption and cost at sustainable levels with increasing requirements on system capacity
• Accessible and desirable functionality of photonics technology for optical interconnect
• Technology for interconnects at center, cabinet, board and chip level
All speakers are invited only to ensure the scope, focus and quality of the presentations to maximize the values of the forum to the attendees. Also,
we will have a panel discussion at the end of the sessions to facilitate brain-storming discussions on some of the critical and pressing issues related to the technologies and applications. This industry forum will be sponsored by HP. Leading industry experts and representatives from academia will present and attend this exciting event. Focus will be on industry related issues.
Industry Forum Organizers
Lars Thylén, Royal Institute of Technology (Sweden) and Hewlett-Packard Labs. (United States)
Michael Tan, Hewlett-Packard Labs. (United States)
Wei Ping Huang, McMaster Univ. (Canada)
Frank Tong, SAE Magnetics (Hong Kong)
